Through-Core Via

ABSTRACT

A package substrate for connecting together semiconductor devices with other semiconductor device packages. The package substrate includes an exposed core layer with at least one via exposing a conductive layer of the package substrate. A first portion of the package substrate may include a solder mask on top and bottom surfaces. A first semiconductor device may be connected to the first portion of the package substrate. Layers of a second portion of the package substrate are removed to expose a core layer and vias are created in the exposed core layer to expose the conductive layer. Conducive material at least partially filling the vias may be used to connect a semiconductor device package to the second portion of the package substrate. The semiconductor device packages may communicate through conductive layers in the package substrate. The package substrate may be used to connect the semiconductor packages to a motherboard.

RELATED APPLICATIONS

The present application is a divisional patent application of U.S.patent application Ser. No. 15/946,139 entitled Through-Core Via filedon Apr. 5, 2018 and published on Oct. 10, 2019 as U.S. Patent App. Pub.No. 2019/0311987, which is incorporated by reference herein in itsentirety.

FIELD

The embodiments described herein relate to a substrate, or printedcircuit board (PCB), for connecting together at least two semiconductordevice packages and methods of providing the substrate, the substratehaving a portion with an exposed core, or dielectric, layer with atleast one via that exposes a portion of a conductive layer of thesubstrate.

BACKGROUND

Semiconductor device assemblies, including, but not limited to, memorychips, microprocessor chips, and imager chips, typically include asemiconductor device, such as a die, mounted on a package substrate. Thepackage substrate and the die (or some portion of each) may be encasedin a plastic protective covering (encapsulant) or metal heat spreader.The semiconductor device assembly may include various functionalfeatures, such as memory cells, processor circuits, and imager devices,and may include bond pads that are electrically connected to thefunctional features of the semiconductor device assembly. Thesemiconductor device assembly may include semiconductor devices stackedupon, and electrically connected to, one another by individualinterconnects between adjacent devices within a package. Thesemiconductor device assemblies may include electrical interconnects(for example, solder balls) in an array pattern on the bottom of thepackage substrate to facilitate electrical connection to othersemiconductor device assemblies or an electronic system.

Various methods and/or techniques may be employed to electricallyinterconnect adjacent semiconductor devices, semiconductor devicepackages, and/or substrates in a semiconductor device assembly. Forexample, in some applications two or more semiconductor device packagesmay be stacked one on top of another known as package-on-package (PoP)assembly. In particular, a PoP device may include an applicationprocessor in a lower package and one or more memory devices in an upperpackage mounted on the lower package. The memory devices may beelectrically connected to the application processor using vias createdin the lower package encapsulant that connect to interconnects (forexample, solder balls) on the bottom of the upper package. The PoPdevice is configured to be mounted onto a main board or motherboard ofan electronic system (such as, for example, a smart phone or tabletcomputer) using interconnects (for example, solder balls) on the bottomof the lower package. Accordingly, the application processorcommunicates directly with the memory devices in the PoP usingelectrically close connections (to minimize the negative electricaleffects of longer electrical transmission lines) but is still able toconnect directly to the main board of the electronic system tofacilitate communications with other devices connected to the mainboard. One potential issue with PoP devices is the z height of thestacked semiconductor device packages. In some applications, the zheight of a semiconductor device assembly may be limited due to spaceconstraints. Additionally, in a PoP device, power and ground connectionsto each of the semiconductor device packages need to pass through eachof the semiconductor device packages located below it in a PoP stack,which may cause a thermal issue and/or routing complexity within thesemiconductor device assembly.

Another method of electrically connecting semiconductor device packagestogether is to place each semiconductor device package side-by-side, oradjacent to each other, on a substrate, such as a motherboard of anelectronic system. The side-by-side configuration may require a largerfootprint (i.e., x-y area) than the same devices in a PoP configuration,which may be problematic. For example, the area available on a substratefor semiconductor device packages may be limited depending on theapplication. Another potential disadvantage of a side-by-sideconfiguration is that the semiconductor device packages cannotcommunicate directly between themselves. Rather, the communications mustpass through the substrate or PCB, such as the motherboard, whencommunicating between two semiconductor device packages in aside-by-side configuration. In some instances, a system may include alarge number of signals passing through the motherboard, and themotherboard may have many levels of electrical connections, therebycausing the electrical paths between the adjacent semiconductor devicepackages to be electrically far compared to the PoP device. Thisincreased electrical length can potentially cause signal delays betweenthe semiconductor device packages configured side-by-side on amotherboard. An increase in the signals through the motherboard may alsocause thermal and/or routing issues.

As discussed above, a PoP package configuration provides closeelectrical connection between various semiconductor devices forapplications where there is sufficient z height available to accommodatethe stacked packages. However, due to the thermal, electrical, and/orphysical drawbacks of the side-by-side configuration, a solution doesnot currently exist to provide close electrical connection betweenmultiple semiconductor devices when z height is constrained, but thereis x-y space available. Additional drawbacks and disadvantages mayexist.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an isometric view of an embodiment of substrate having aplurality of vias through an exposed core, or dielectric, layer toexpose a portion of a conductive layer.

FIG. 2 is a cross-section schematic of an embodiment of a packagesubstrate having a plurality of vias through an exposed core, ordielectric, layer to expose a portion of a conductive layer.

FIG. 3 is a schematic of an embodiment of a semiconductor deviceassembly.

FIG. 4 is a cross-section schematic of an embodiment of a semiconductordevice assembly.

FIG. 5 is a schematic of an embodiment of a semiconductor deviceassembly.

FIG. 6 is a schematic of an embodiment of a semiconductor deviceassembly.

FIG. 7 is a cross-section schematic of an embodiment of a semiconductordevice assembly.

FIG. 8 is a cross-section schematic of an embodiment of a semiconductordevice assembly.

FIG. 9 is a flow chart depicting an embodiment of a method of making asemiconductor device assembly.

FIG. 10 is a flow chart depicting an embodiment of a method of making asemiconductor device assembly.

While the disclosure is susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and will be described in detail herein. However,it should be understood that the disclosure is not intended to belimited to the particular forms disclosed. Rather, the intention is tocover all modifications, equivalents and alternatives falling within thescope of the disclosure as defined by the appended claims.

DETAILED DESCRIPTION

In this disclosure, numerous specific details are discussed to provide athorough and enabling description for embodiments of the presentdisclosure. One of ordinary skill in the art will recognize that thedisclosure can be practiced without one or more of the specific details.Well-known structures and/or operations often associated withsemiconductor devices and semiconductor device packages may not be shownand/or may not be described in detail to avoid obscuring other aspectsof the disclosure. In general, it should be understood that variousother devices, systems, and/or methods in addition to those specificembodiments disclosed herein may be within the scope of the presentdisclosure.

The terms “semiconductor device assembly” can refer to an assembly ofone or more semiconductor devices, semiconductor device packages, and/orsubstrates, which may include interposers, supports, and/or othersuitable substrates. The semiconductor device assembly may bemanufactured as, but not limited to, discrete package form, strip ormatrix form, and/or wafer panel form. The term “semiconductor device”generally refers to a solid-state device that includes semiconductormaterial. A semiconductor device can include, for example, asemiconductor substrate, wafer, panel, or a single die from a wafer orsubstrate. A semiconductor device may refer herein to a semiconductordie, but semiconductor devices are not limited to semiconductor dies.Moreover, a semiconductor device may have logic, memory, storage, orsome other electronic functions, or a combination of any of these.

The term “semiconductor device package” can refer to an arrangement withone or more semiconductor devices incorporated into a common package. Asemiconductor package can include a housing or casing (encapsulant) thatpartially or completely encapsulates at least one semiconductor device.A semiconductor package can also include a package substrate thatcarries one or more semiconductor devices. The package substrate may beattached to or otherwise incorporated within the housing or casing.

As used herein, the terms “vertical,” “lateral,” “upper,” and “lower”can refer to relative directions or positions of features in thesemiconductor devices and/or semiconductor device assemblies shown inthe Figures. For example, “upper” or “uppermost” can refer to a featurepositioned closer to the top of a page than another feature. Theseterms, however, should be construed broadly to include semiconductordevices and/or semiconductor device assemblies having otherorientations, such as inverted or inclined orientations wheretop/bottom, over/under, above/below, up/down, and left/right can beinterchanged depending on the orientation.

Various embodiments of this disclosure are directed to semiconductordevices, semiconductor device assemblies, semiconductor packages,semiconductor device packages, and methods of making and/or operatingsemiconductor devices.

An embodiment of the disclosure is a package substrate comprising asubstrate having a first portion having a first thickness and a secondportion having a second thickness less than the first thickness, thefirst portion having a first surface and a second surface opposite thefirst surface. The first surface of the substrate being a first soldermask and the second surface of the substrate being a second solder mask,the first portion of the substrate having at least one first conductivelayer, at least one second conductive layer, and at least one core layerbetween the first surface and the second surface, wherein the core layeris positioned between the first and second conductive layers. The secondportion of the substrate having a third surface opposite the secondsurface, the third surface including an exposed portion of the corelayer and at least one via through the core layer in the second portionof the substrate such that the via exposes a portion of the secondconductive layer.

An embodiment of the disclosure is a semiconductor device assemblycomprising a package substrate having a first portion with a firstsurface and a second surface opposite of the first surface with thesecond surface extending to a second portion of the substrate, thesecond portion of the substrate having a third surface opposite of thesecond surface. The third surface of the substrate being configured toconnected to a semiconductor device package. The semiconductor deviceassembly including a first semiconductor device connected to the firstsurface of the first portion of the substrate and an encapsulatesubstantially surround the first semiconductor device and the firstinterconnects and covering at least a portion of the first surface.

An embodiment of the disclosure is a package substrate comprising asubstrate having a first plurality of conductive layers and secondplurality of core layers, each of the core layers being positionedbetween two conductive layers. The substrate having a first portion anda second portion, the first portion having a first thickness and thesecond portion having a second thickness that is less than the firstthickness, the second portion of the substrate comprises an exposed corelayer of the second plurality of core layers. The package substratecomprises one or more vias in the exposed core layer, the one or morevias exposing a portion of one conductive layer of the first pluralityof conductive layers.

An embodiment of the disclosure is a method of making a semiconductordevice assembly comprising connecting a semiconductor device to a firstsurface of a first portion of a package substrate, a second portion ofthe package substrate including an exposed portion of a core layer withat least one via through the core layer exposing a portion of aconductive layer. The method comprises encapsulating the semiconductordevice and at least a portion of the first surface of the first portionof the package substrate.

A PCB may include a number of conductive layers that are separated fromeach other by insulating layers, which may be comprised of dielectricmaterial. As used herein, the term “conductive layer” refers to a layercomprised of a conducting material. Conductive layers may be comprisedof various materials as would be appreciated by one of ordinary skill inthe art. For example, a conductive layer may be, but is not limited to,copper foil. The insulating layers are commonly referred to as coreand/or prepreg layers. Core and/or prepreg layers may be comprised ofvarious materials as would be appreciated by one of ordinary skill inthe art. For example, such layers may be, but are not limited to, glasscloth, which may be made from fiber, glass, and epoxy. As used herein,the terms “core,” “core layer,” and “dielectric layer” refer to aninsulating layer positioned between conductive layers of a PCB and/orsubstrate. A solder mask may be provided on a first or top surface ofthe PCB. Likewise, a solder mask may be provided on a second or bottomsurface of the PCB. Openings or apertures in the solder mask on thefirst and/or second surface expose a portion of an adjacent conductinglayer permitting the PCB to be electrically connected to semiconductordevice or semiconductor device packages connected to the first and/orsecond surface of the PCB. Likewise, the apertures in the solder maskmay permit the PCB to be electrically connected to another substrate aswould be appreciated by one of ordinary skill in the art.

FIG. 1 is an isometric view of an embodiment of a package substrate 100having a first portion 100A and a second portion 100B. The packagesubstrate may be various structures as would be appreciated by one ofordinary skill in the art having the benefit of this disclosure. Forexample, the package substrate 100 may be, but is not limited to, a PCB,a silicon interposer, or a tape interposer. The first portion 100Aincludes a first, or top, surface 101A and a second, or bottom, surface102 (best shown in FIG. 2) that extends to the second portion 100B ofthe package substrate 100. The first surface 101A of the first portion100A of the package substrate 100 include a first solder mask 130A (bestshown in FIG. 2). The second surface 102 of the package substrate 100includes a second solder mask 130B (best shown in FIG. 2). The firstsolder mask 130A does not extend to the second portion 101B of thepackage substrate 100. In other words, the first solder mask 130A isabsent from the second portion 100B of the package substrate 100.

The first solder mask 130A includes a plurality of openings, orapertures, 131 that expose a portion of a conductive layer 110A (bestshown in FIG. 2) adjacent to the first solder mask 130A. Likewise, thesecond solder mask 130B includes a plurality of openings, or apertures,131 that expose a portion of a conductive layer 110D (best shown in FIG.2) adjacent to the second solder mask 130B. The apertures 131 in thesolder masks 130A, 130B permit a semiconductor device, semiconductordevice package, and/or substrate to be electrically connected to thepackage substrate 100 as would be appreciated by one of ordinary skillin the art having the benefit of this disclosure. The number, size,shape, location, and/or configuration of the apertures 131 in the soldermasks 130A, 130B are shown for illustrative purposes and may be varieddepending on the application as would be appreciated by one of ordinaryskill in the art having the benefit of this disclosure.

The second portion 100B may provide an interface for the electricalconnection to a semiconductor device package, as discussed herein. Thesecond portion 100B of the package substrate 100 has a third, or top,surface 101B that comprises an exposed core, or dielectric, layer 120B(best shown in FIG. 2) of the package substrate 100. As shown in FIG. 1,the first solder mask 130A is absent from the third surface 101B of thesecond portion 100B of the substrate 100. The third surface 101Bincludes a plurality of vias 125 through the exposed core layer 120Bthat expose a portion of a conductive layer 110C (best shown in FIG. 2)adjacent to the exposed core layer 120B, which comprises the top surface101B of the second portion 100B of the package substrate 100. Aconductive material may at least partially, or completely, fill each ofthe vias 125. For example, solder balls 135 may be positioned in eachvia 125. Solder balls 135 are not shown in each via 125 for clarity. Thenumber, size, shape, location, and/or configuration of the solder balls135 and/or vias 125 through the exposed core layer 120B are shown forillustrative purposes and may be varied depending on the application aswould be appreciated by one of ordinary skill in the art having thebenefit of this disclosure.

FIG. 2 is a cross-section schematic of an embodiment of a packagesubstrate 100 having a plurality of vias, collectively, 125 through anexposed core, or dielectric, layer 120B to expose a portion of theadjacent conductive layer 110C. FIG. 2 shows that the first portion 100Aof the package substrate 100 is a four layer plus core PCB. In otherwords, the first portion 100A of the substrate includes four conductivelayers 110A, 110B, 110C, 110D with each conductive layer 110A, 110B,110C, 110D separated from each other with a respective core layer 120A,120B, 120C. The package substrate 100 includes interconnects (not shown)that electrically connect the four conductive layers 110A, 110B, 110C,110D as would be appreciated by one of ordinary skill in the art. Afirst solder mask 130A is positioned adjacent conductive layer 110A anda second solder mask 130B is positioned adjacent conductive layer 110D.As discussed herein, the solder masks 130A, 130B include openings, orapertures, 131 that expose portions of the adjacent conductive layers110A, 110D to enable the package substrate 100 to be electricallyconnected to devices and/or a substrate (such as a main board in anelectronic system) as would be appreciated by one of ordinary skill inthe art. The package substrate 100 is shown as a four-layer plus corePCB for illustrative purposes. The number of conductive layers,collectively, 110 and core layers, collectively, 120 may be varieddepending on the application as would be appreciated by one of ordinaryskill in the art having the benefit of this disclosure. In particular,the package substrate 100 may have only two conductive layers 110 and asingle core layer 120 therebetween.

The core layer 120B is exposed on the second portion 100B of the packagesubstrate 100. Various mechanisms may be used to expose the core layer120B as would be appreciated by one of ordinary skill in the art. Forexample, the first solder mask 130A may not be deposited on theconductive layer 110A on the second portion 100B of the packagesubstrate 100 and the conductive layers 110A, 110B and the core layer120A may be etched away from the second portion 100B of the substrate100 to expose the core layer 120B. Alternatively, the first solder mask130A may be removed from the second portion 100B of the packagesubstrate 100 prior to etching away the conductive layers 110A, 110B andthe core layer 120A. The removal of the conductive layers 110A, 110B andthe core layer 120A results in the second portion 100B of the packagesubstrate 100 having a second thickness, T2, that is less than the firstthickness, T1, of the first portion 100A of the package substrate 100.The reduction in thickness, T2, for the second portion 100B of thepackage substrate 100 may enable a reduction in the z height of asemiconductor device package connected to the exposed core layer 120B ofthe second portion 100B of the package substrate 100.

The exposed core layer 120B of the second portion 100B includes one ormore vias 125 through the exposed core layer 120B. The vias 125 may bedrilled via a laser through the exposed core layer 120B. Othermechanisms may be used to form the vias 125 as would be appreciated byone of ordinary skill in the art having the benefit of this disclosure.For example, a mechanical drill may be used to form the vias 125 throughthe exposed core layer 120B. As shown in FIG. 2, vias 125A may bedrilled through the exposed core layer 120B to expose a portion of theadjacent conductive layer 110C. Alternatively, vias 125B may be drilledthrough the exposed core layer 120B, the adjacent conductive layer 110C,and the core layer 120C to expose conductive layer 110D, as shown inFIG. 2. The configuration of the vias, collectively, 125 on the secondportion 100B of the package substrate 100 enables two semiconductordevice packages to be electrically connected together in a side-by-sideconfiguration and enables the semiconductor device packages tocommunicate without needing to communicate through a motherboard, asdiscussed herein.

FIG. 3 is a schematic of an embodiment of a semiconductor deviceassembly 500. The semiconductor device assembly 500 includes two firstsemiconductor device packages 200A, 200B, a second semiconductor devicepackage 300, and a motherboard 400. The first semiconductor devicepackages 200A, 200B may be memory packages. The first semiconductordevice packages 200A, 200B may not be identical. For example, firstsemiconductor device package 200A may include, but is not limited to,128 GB NAND flash, 4 GB DRAM, and a controller (which may be, forexample, an eMCP device) and first semiconductor device package 200B mayinclude, but is not limited to, 128 GB NAND flash and a controller(which may be, for example, an eMMC device). The first semiconductordevice packages 200A, 200B may include one or more semiconductor devicespackaged together as would be appreciated by one of ordinary skill inthe art. The first semiconductor device packages 200A, 200B may eachinclude a memory controller or, alternatively, one of the firstsemiconductor device packages 200A, 200B may include a single controllerconfigured to operate for both semiconductor device packages 200A, 200B.The second semiconductor device package 300 may be, but is not limitedto, a processor. Each semiconductor device package 200A, 200B includeselectrical connections between the semiconductor devices therein and therespective package substrate. These electrical connections may include,for example, wire bonds, solder balls, and/or interconnect pillars.Additionally, when a semiconductor device package 200A or 200B containstwo or more semiconductor devices in a stacked arrangement, thesemiconductor devices may be stacked in various configurations,including, for example, a cube-type stack or a shingle-stackarrangement. The semiconductor devices in the stack may be electricallyconnected to each other and/or the respective package substrate using,for example, wire bonds, solder balls, interconnect pillars, and/orthrough-silicon-vias (TSVs). Each semiconductor device package 200A,200B may include an encapsulant that encapsulates the semiconductordevices, the electrical connections from the semiconductor devices tothe respective package substrate, and at least a portion of therespective package substrate.

Each of the two first semiconductor device packages 200A, 200B includesa first portion 100A (best shown in FIGS. 1-2) of a package substrate100, 100′. The semiconductor device packages 200A, 200B include packagesubstrates 100, 100′. The second surface 102 (best shown in FIGS. 1-2)of the package substrates 100, 100′ is connected to the motherboard 400.The substrates 100, 100′ each may be connected to the motherboard 400 byvarious mechanisms as would be appreciated by one of ordinary skill inthe art having the benefit of this disclosure. For example, the packagesubstrates 100, 100′ may be connected to the motherboard 400 usinginterconnects (such as solder balls, as discussed below) in an arraypattern (for example, a land grid array (LGA) pattern), solder paste,thermal paste, or some other adhesive material.

A second portion 100B (best shown in FIGS. 1-2) of each packagesubstrate 100, 100′ extends beyond the encapsulant of the semiconductorpackages 200A, 200B, as shown in FIG. 3. The second portion 100Bincludes a plurality of vias 125 that enable the second semiconductordevice package 300 to be electrically connected to both packagesubstrates 100, 100′. Conductive material, such as solder balls, (notshown for clarity) may be used to electrically connect the secondsemiconductor device package 300 to the second portions 100B of each ofthe package substrates 100, 100′. The package substrates 100, 100′enable communication between the second semiconductor device package300, which may be a processor, and the semiconductor devices in each ofthe first semiconductor device packages 200A, 200B, which may be memorypackages, without the need to send the communication signals through themotherboard 400 as would be appreciated by one of ordinary skill in theart having the benefit of this disclosure. Accordingly, thesemiconductor devices in the first semiconductor device packages 200A,200B can be electrically close to the second semiconductor devicepackage 300.

The motherboard 400 may include a plurality of vias or pads 425 thatenable the second semiconductor device package 300 to be electricallyconnected to the motherboard 400. Solder balls 335 are shown on thebottom of the second semiconductor device package 300 for illustrativepurposes. Different sized solder balls, or other conductive material,may electrically connect the second semiconductor device package 300 tothe motherboard 400 than the size of the solder balls used toelectrically connect the second semiconductor device package 300 to thesecond portions 100B of the package substrates 100, 100′. FIG. 3 shows asymmetrical configuration of first semiconductor device packages 200A,200B on a motherboard 400. However, other configurations may be useddepending on the application as would be appreciated by one of ordinaryskill in the art having the benefit of this disclosure.

FIG. 4 is a cross-section schematic of a semiconductor device assembly500. As shown, the first semiconductor device packages 200A, 200B maynot be identical. For example, first semiconductor device package 200Aincludes semiconductor devices 210, 220, and 250 within packagingmaterial or encapsulant 205, which may be a mold compound, whereas firstsemiconductor device package 200B only includes semiconductor devices210 and 220 within packaging material 205. Semiconductor devices 210 and220 may be memory semiconductor devices and semiconductor device 250 maybe a controller. Various mechanisms may be used to connect thesemiconductor devices 210, 220, 250 of the semiconductor device packages200A, 200B to the respective substrate 100, 100′ as would be appreciatedby one of ordinary skill in the art having the benefit of thisdisclosure. For example, solder balls 201 may connect semiconductordevices 210, 220, 250 of semiconductor device package 200A to thepackage substrate 100. Likewise, wire bonds 202 may connectsemiconductor devices 210, 220 of semiconductor device package 200B tothe package substrate 100′. The substrates 100, 100′ each may beconnected to the motherboard 400 by various mechanisms as would beappreciated by one of ordinary skill in the art having the benefit ofthis disclosure. For example, the package substrates 100, 100′ may beconnected to the motherboard 400 using interconnects (such as solderballs, as discussed below) in an array pattern (for example, a land gridarray (LGA) pattern), solder paste, thermal paste, or some otheradhesive material.

The second surface 102 of each package substrate 100, 100′ is connectedto a second substrate 400, which may be a motherboard (hereinafterreferred to as motherboard). Electrical connections 115, which may besolder balls, may electrically connect each substrate 100, 100′ to themotherboard 400. The electrical connections 115 may be configured toonly provide power and ground from the motherboard 400 to the substrates100, 100′. In another configuration, the electrical connections 115 maybe dummy connections with all communication and power between thesubstrates 100, 100′ and the motherboard 400 being routed through theconnections between the second semiconductor device package 300 and themotherboard 400.

The second semiconductor device package 300 is connected to secondportions 100B of the package substrates 100, 100′ via electricalconnections 135. The electrical connections 135 enable signals to besent between the first semiconductor device packages 200A, 200B and thesecond semiconductor device package 300 without being routed through themotherboard 400. The second semiconductor device package 300 isconnected to the motherboard 400 via electrical connections 335, whichmay be solder balls. The solder balls 335 connecting the secondsemiconductor device package 300 to the motherboard 400 may be largerthan the solder balls 135 connecting the second semiconductor devicepackage 300 to the package substrates 100, 100′ due to the thickness,T2, of the second portion 100B of the package substrates 100, 100′.

The number, size, shape, location, and/or configuration of the variouscomponents of the semiconductor device assembly 500 are not necessarilydrawn to scale. The number, size, shape, location, and/or configurationof the semiconductor devices 210, 220, 250, the packaging material 205,the package substrates 100, 100′, the first semiconductor devicepackages 200A, 200B, the second semiconductor device package 300, theconnections 115, 135, 335, and the motherboard 400 are shown forillustrative purpose and may be varied depending on the application aswould be appreciated by one of ordinary skill in the art having thebenefit of this disclosure.

FIG. 5 is a schematic of an embodiment of a semiconductor deviceassembly 600. The semiconductor device assembly 600 includes two firstsemiconductor device packages 200C, 200D and a second semiconductordevice package 300 and a motherboard 400. The first semiconductor devicepackages 200C, 200D may be memory packages. The first semiconductordevice packages 200C, 200D may not be identical. For example, firstsemiconductor device package 200C may comprise 256 GB NAND flash and acontroller and first semiconductor device package 200D may comprise 8 GBLPDRAM. The size and/or shape of the first semiconductor device packages200C, 200D may provide for an asymmetrical configuration, as shown inFIG. 5.

Each of the two first semiconductor device packages 200C, 200D include afirst portion 100A (best shown in FIGS. 1-2) of a respective packagesubstrate 100, 100′. The second surface 102 (best shown in FIGS. 1-2) ofeach of the package substrates 100, 100′ is connected to the motherboard400. The package substrates 100, 100′ each may be connected to themotherboard 400 by various mechanisms as would be appreciated by one ofordinary skill in the art having the benefit of this disclosure.

A second portion 100B (best shown in FIGS. 1-2) of each packagesubstrate 100, 100′ extends beyond the encapsulant of the firstsemiconductor device packages 200C, 200D. As shown in FIG. 5, the secondportions 100B of each package substrate 100, 100′ that extends beyondthe encapsulant of the first semiconductor device packages 200C, 200Dmay differ in length. Each of the second portions 100B of the packagesubstrates 100, 100′ includes a plurality of vias 125 that enable thesecond semiconductor device package 300 to be electrically connected toeach package substrate 100, 100′. Conductive material, such as solderballs, (not shown for clarity) may be used to electrically connect thesecond semiconductor device package 300 to the second portions 100B ofeach of the package substrates 100, 100′. The package substrates 100,100′ enable communication between the second semiconductor devicepackage 300, which may be a processor, and each of the firstsemiconductor device packages 200C, 200D, which may be memory packages,without the need to send the communication signals through themotherboard 400 as would be appreciated by one of ordinary skill in theart having the benefit of this disclosure. As discussed herein, themotherboard 400 may include a plurality of vias or pads 425 that enablethe second semiconductor device package 300 to be electrically connectedto the motherboard 400.

FIG. 6 is a schematic of an embodiment of a semiconductor deviceassembly 700. The semiconductor device assembly 700 includes two firstsemiconductor device packages 200E, 200F and a second semiconductordevice package 300 and a motherboard 400. The first semiconductor devicepackages 200E, 200F may be memory packages. The first semiconductordevice packages 200E, 200F may not be identical. For example, firstsemiconductor device package 200E may comprise 256 GB NAND flash, 4 GBLPDRAM, and a controller and first semiconductor device package 200F maycomprise 4 GB LPDRAM. The size and or shape of the first semiconductordevice packages 200E, 200F may provide for a symmetrical configurationor an asymmetrical configuration, as discussed herein. The firstsemiconductor device packages 200E, 200F, and the second semiconductordevice package 300 may be electrically connected through the packagesubstrates 100, 100′ in a similar fashion as the correspondingcomponents in FIG. 5.

FIG. 7 is a cross-section schematic of a semiconductor device assembly800. The semiconductor device assembly 800 includes two firstsemiconductor device packages 200A, 200B, which both may be memorypackages. As shown, the first semiconductor device packages 200A, 200Bmay not be identical. For example, first semiconductor device package200A includes semiconductor devices 210 and 250 within packagingmaterial 205, which may be a mold compound, whereas first semiconductordevice package 200B only includes semiconductor device 230 withinpackaging material 205. Semiconductor devices 210 and 230 may comprisememory semiconductor devices and semiconductor device 250 may be acontroller. The semiconductor devices 210, 230, and 250 within the firstsemiconductor device packages 200A, 200B may be in variousconfigurations. For example, the semiconductor devices may be configuredin a stack as shown with respect to semiconductor devices 210.Alternatively, the semiconductor devices may be arranged in aside-to-side configuration as shown with respect to semiconductor device210 and semiconductor device 250. The semiconductor device packages200A, 200B may include various numbers, sizes, shapes, and/orconfigurations of semiconductor devices as would be appreciated by oneof ordinary skill in the art having the benefit of this disclosure.

Various mechanisms may be used to connect the semiconductor devices 210,210 to each other and may be used to connect the semiconductor devices210, 230 to the package substrates 100, 100′ as would be appreciated byone of ordinary skill in the art. For example, through silicon vias(TSVs) 203 and pillars 204 may be used to connect semiconductor devices210 together. Likewise, TSVs 203 and pillars 204 may be used to connectthe semiconductor devices 210, 230 to the respective package substrates100, 100′. First semiconductor device package 200A includes a surface101A of a first portion 100A of a package substrate 100. Likewise, firstsemiconductor device package 200B includes a surface 101A of a firstportion 100A of a package substrate 100′.

The second surface 102 of each package substrate 100, 100′ is connectedto a motherboard 400. Electrical connections 115, which may be solderballs, may electrically connect each substrate 100, 100′ to themotherboard 400. The electrical connections 115 may be configured toonly provide power and/or ground from the motherboard 400 to thesubstrates 100, 100′. In another configuration, the electricalconnections 115 may be dummy connections with all communication andpower between the substrates 100, 100′ and the motherboard 400 beingrouted through the connections between the second semiconductor devicepackage 300 and the motherboard 400.

A second semiconductor device package 300A, which may be a processor, isconnected to second portions 100B of the package substrates 100, 100′via electrical connections 135. The electrical connections 135 enablesignals to be sent between the first semiconductor device packages 200A,200B and the second semiconductor device package 300A without beingrouted through the motherboard 400. The second semiconductor devicepackage 300A may be configured to have a shape that conforms to theconfiguration of the package substrates 100, 100′ and the motherboard400. As shown in FIG. 7, the shape of the second semiconductor devicepackage 300A may enable the electrical connections, e.g. solder balls135, used to connect the package substrates 100, 100′ to the secondsemiconductor device package 300A to be the same size as those used toelectrically connect the second semiconductor device package 300A to themotherboard 400. It may be beneficial to use the same size solder balls135 to connect the second semiconductor device package 300A to both ofthe package substrates 100, 100′ and the motherboard 400 as would beappreciated by one of ordinary skill in the art having the benefit ofthis disclosure. In some embodiments, the solder balls 115 connectingthe package substrates 100, 100′ to the motherboard 400 may be the samesize as the solder balls 135 electrically connecting the secondsemiconductor device package 300A to the package substrates 100, 100′and the motherboard 400.

The number, size, shape, location, and/or configuration of the variouscomponents of the semiconductor device assembly 800 are not necessarilydrawn to scale. The number, size, shape, location, and/or configurationof the semiconductor devices 210, 230, 250, the packaging material 205,the package substrates 100, 100′, the first semiconductor devicepackages 200A, 200B, the second semiconductor device package 300A, theconnections 115, 135, and the motherboard 400 are shown for illustrativepurpose and may be varied depending on the application as would beappreciated by one of ordinary skill in the art having the benefit ofthis disclosure.

FIG. 8 is a cross-section schematic of an embodiment of a semiconductordevice assembly 900. The semiconductor device assembly 900 includes twofirst semiconductor devices packages 200A, 200B, which both may bememory packages. As shown, the first semiconductor device packages 200A,200B may not be identical. For example, first semiconductor devicepackage 200A includes semiconductor devices 210 and 250 within packagingmaterial 205, which may be a mold compound, whereas first semiconductordevice package 200B includes semiconductor devices 220 and 250 withinpackaging material 205. Semiconductor devices 210 and 220 may comprisememory semiconductor devices and semiconductor devices 250 may be acontroller. The semiconductor device packages 200A, 200B may includevarious numbers, sizes, shapes, and/or configurations of semiconductordevices as would be appreciated by one of ordinary skill in the arthaving the benefit of this disclosure.

Semiconductor devices 210, 250 of first semiconductor device package200A are connected to a surface 151A of a first portion 150A of apackage substrate 150. Additionally, packaging material 205 of firstsemiconductor device package 200A at least partially covers the surface151A of the first portion 150A of the package substrate 150. Likewise,semiconductor devices 220, 250 of first semiconductor device package200B are connected to a surface 151C of a third portion 150C of thepackage substrate 150. Various mechanisms may be used to connect thesemiconductor devices 210, 220, 250 in first semiconductor packages200A, 200B to the respective surfaces 150A, 150C of the packagesubstrate 150 as would be appreciated by one of ordinary skill in theart having the benefit of this disclosure. The package substrate 150includes a second portion 150B that is positioned between the firstportion 150A and the third portion 150C of the substrate 150. The secondportion 150B of the package substrate 150 includes a surface 151B thatis an exposed core layer, as discussed herein.

A second surface 152 of the package substrate 150 is connected to amotherboard 400. Electrical connections 115, which may be solder balls,may electrically connect the package substrate 150 to the motherboard400. A second semiconductor device package 300, which may be aprocessor, is connected to the second portion 150B of the substrate 150via electrical connections 305. The electrical connections 305 enablesignals to be sent between the first semiconductor device packages 200A,200B and the second semiconductor device package 300 without beingrouted through the motherboard 400 as would be appreciated by one ofordinary skill in the art having the benefit of this disclosure.

The number, size, shape, location, and/or configuration of the variouscomponents of the semiconductor device assembly 900 are not necessarilydrawn to scale. The number, size, shape, location, and/or configurationof the semiconductor devices 210, 220, 250, the packaging material 205,the package substrate 150, the first semiconductor device packages 200A,200B, the second semiconductor device package 300, the connections 115,305, and the motherboard 400 are shown for illustrative purpose and maybe varied depending on the application as would be appreciated by one ofordinary skill in the art having the benefit of this disclosure.

FIG. 9 is a flow chart of an embodiment of a method 1000 for making asemiconductor device assembly. The method 1000 includes providing asubstrate having a first surface opposite a second surface, the firstsurface including a first solder mask on a first portion of thesubstrate, the first solder mask being absent from a second portion ofthe substrate, the second surface including a second solder mask, thesubstrate having a first plurality of conductive layers and a secondplurality of dielectric layers between the first surface and the secondsurface, wherein the conductive layers are separated by the dielectriclayers, at 1010. The method 1000 may include the optional steps ofremoving at least one conductive layer of the first plurality ofconductive layers and at least one dielectric layer of the secondplurality of dielectric layers, at 1015, and etching away two conductivelayers and one dielectric layer, at 1025. The method 1000 comprisescreating at least one via through at least one dielectric layer of thesecond plurality of dielectric layers exposing a portion of oneconductive layer of the first plurality of conductive layers, at 1020.

The method 1000 may include drilling the at least one via with a laser,at 1035. Other methods may be used to form the at least one via as wouldbe appreciated by one of ordinary skill in the art having the benefit ofthis disclosure. For example, a mechanical drill may be used to form theat least one via. The method 1000 may include the optional step ofattaching a first semiconductor device package to the first surface ofthe first portion of the substrate, at 1045. For example, a memorypackage, or other semiconductor device package, may be attached to thefirst surface of the first portion of the substrate. The method 1000 mayinclude at least partially filling the at least one via with aconductive material, at 1055. For example, the at least one via may beat least partially filled with a solder ball. The method 1000 mayinclude attaching a second semiconductor device package to the secondportion of the substrate, at 1065. For example, a processor may beattached to the second portion of the substrate.

FIG. 10 is a flow chart of an embodiment of a method 1100 for making asemiconductor device assembly. The method 1100 includes connecting asemiconductor device to a first surface of a first portion of a packagesubstrate, a second portion of the package substrate including anexposed portion of a core layer with at least one via through the corelayer exposing a portion of a conductive layer, at 1110. Thesemiconductor device may be connected to the first surface of thepackage substrate by various mechanisms, as discussed herein. Forexample, the semiconductor device may be, but is not limited to,connected to the package substrate via wire bonds, solder balls, or TSVsand pillars. The method 1100 may optionally include providing thepackage substrate and drilling the at least one via through the corelayer to expose a portion of the conductive layer prior to connectingthe semiconductor device to the first surface of the first portion. Theexposed core layer may include a plurality of vias that at leastpartially expose the conductive layer. The method 1100 includesencapsulating the semiconductor device at least a portion of the firstsurface of the first portion of the package substrate, at 1120.

The method 1100 may include connecting a second surface of the packagesubstrate to a motherboard, the second surface being opposite the firstsurface, at 1130. The second surface of the package substrate extendingto the second portion of the package substrate. The method 1100 mayinclude connecting a semiconductor device package to the second portionof the substrate package and connecting the semiconductor device packageto the motherboard, at 1140. The semiconductor device package may beconnected to the semiconductor substrate through the at least one viathrough the core layer. The semiconductor device package may be aprocessor device. Connecting the semiconductor device package to thesemiconductor substrate may include at least partially filling the atleast one via with a conductive material.

The method 1100 may include connecting a semiconductor device package tothe second portion of the package substrate, at 1150, prior toconnecting the second surface of the package substrate to themotherboard. The method 1100 may include connecting a secondsemiconductor device to a third portion of the package substrate andencapsulating the second semiconductor device and at least a portion ofa surface of the third portion of the package substrate, wherein thesecond portion of the package substrate is positioned between the firstand third portions, at 1160. After connecting the second semiconductordevice to the third portion and encapsulating the second semiconductordevice, the method 1100 may include connecting a second surface of thepackage substrate to a motherboard, the second surface being oppositethe first surface, at 1130, and connecting a semiconductor devicepackage to the second portion of the substrate package and connectingthe semiconductor device package to the motherboard, at 1140.

Although this disclosure has been described in terms of certainembodiments, other embodiments that are apparent to those of ordinaryskill in the art, including embodiments that do not provide all of thefeatures and advantages set forth herein, are also within the scope ofthis disclosure. The disclosure may encompass other embodiments notexpressly shown or described herein. Accordingly, the scope of thepresent disclosure is defined only by reference to the appended claimsand equivalents thereof.

What is claimed is:
 1. A semiconductor device assembly comprising: apackage substrate having a first portion with a first surface and asecond surface opposite the first surface of the first portion, thesecond surface extending to a second portion of the substrate, thesecond portion of the substrate having a third surface opposite thesecond surface, the third surface configured to connect to asemiconductor device package; at least one first semiconductor deviceconnected to the first surface of the first portion of the substrate bya plurality of first interconnects; and an encapsulant substantiallysurrounding the first semiconductor device and the first interconnectsand covering at least a portion of the first surface.
 2. The assembly ofclaim 1, wherein the second surface of the package substrate isconfigured to connect to a motherboard.
 3. The assembly of claim 2, thethird surface comprising a plurality of vias.
 4. The assembly of claim3, wherein each of the plurality of vias is through a core layer in thepackage substrate, the vias exposing a portion of a conductive layer inthe package substrate.
 5. The assembly of claim 4, comprising thesemiconductor device package connected to the third surface of thesecond portion of the substrate by a plurality of second interconnects.6. The assembly of 5, wherein the first semiconductor device comprises amemory device and the semiconductor device package comprises aprocessor.
 7. The assembly of claim 6, further comprising a PCBconnected to the second surface of the substrate.
 8. The assembly ofclaim 1, the second surface of the package substrate connected to amotherboard and comprising electrical connections between the packagesubstrate and the motherboard.
 9. The assembly of claim 8, wherein theelectrical connections are configured to provide power and ground fromthe motherboard to the package substrate.
 10. The assembly of claim 9,wherein the semiconductor device communicates through the packagesubstrate with the semiconductor device package connected to the thirdsurface of the second portion of the substrate.
 11. The assembly ofclaim 8, wherein the electrical connections between the packagesubstrate and the motherboard are dummy electrical connections andwherein power and ground to the semiconductor device are provided fromthe semiconductor device package through the package substrate.
 12. Theassembly of claim 1, wherein the first semiconductor device comprises amemory device and a memory controller.
 13. The assembly of claim 12,further comprising a processor device connected to the third surface ofthe second portion of the package substrate.
 14. The assembly of claim1, the package substrate having a third portion, the second surfaceextending to the third portion with a fourth surface of the thirdportion opposite the second surface, the fourth surface configured toconnect to at least one second semiconductor device, wherein the secondportion of the package substrate is positioned between the first portionof the package substrate and the third portion of the package substrate.15. The assembly of claim 14, comprising the second semiconductor deviceconnected to the fourth surface of the third portion of the packagesubstrate by a plurality of third interconnects.
 16. The assembly ofclaim 15, wherein the first semiconductor device and the secondsemiconductor device comprise memory devices.
 17. The assembly of claim16, comprising the semiconductor device package connected to the secondportion of the package substrate.
 18. The assembly of claim 17, whereinthe semiconductor device package comprises a processor device.
 19. Apackage substrate comprising: a substrate having a first plurality ofconductive layers and a second plurality of core layers, each of thecore layers being positioned between two conductive layers; thesubstrate having a first portion and a second portion, the first portionhaving a first thickness and the second portion having a secondthickness that is less than the first thickness, the second portion ofthe substrate comprises an exposed core layer of the second plurality ofcore layers; and one or more vias in the exposed core layer, the one ormore vias exposing a portion of one conductive layer of the firstplurality of conductive layers.
 20. The package substrate of claim 19,wherein the second plurality of core layers are dielectric material. 21.The package substrate of claim 20, comprising conductive material atleast partially filing the one or more vias in the exposed layer. 22.The package substrate of claim 21 wherein first portion of the substratecomprises a first solder mask and a second solder mask, the firstplurality of conductive layers and second plurality of core layers ofthe first portion of the substrate being positioned between the firstand second solder masks and wherein the second solder mask extends tothe second portion of the substrate.
 23. The package substrate of claim22, comprising one or more apertures in the first solder mask, the oneor more apertures exposing a portion of a conductive layer of the firstplurality of conductive layers.
 24. A method of making a semiconductordevice assembly comprising: connecting a semiconductor device to a firstsurface of a first portion of a package substrate, a second portion ofthe package substrate including an exposed portion of a core layer withat least one via through the core layer exposing a portion of aconductive layer; and encapsulating the semiconductor device and atleast a portion of the first surface of the first portion of the packagesubstrate.
 25. The method of claim 24, comprising connecting a secondsurface of the package substrate to a motherboard, the second surfacebeing opposite the first surface of the first portion of the packagesubstrate, wherein the second surface extends to the second portion ofthe package substrate.
 26. The method of claim 25, comprising connectinga semiconductor device package to the second portion of the packagesubstrate and connecting the semiconductor device package to themotherboard.
 27. The method of claim 26, wherein connecting thesemiconductor device package to the second portion of the packagesubstrate comprises connecting the semiconductor device package to theconductive layer through the at least one via through the core layer.28. The method of claim 27, wherein the semiconductor device packagecomprises a processor device.
 29. The method of claim 27, whereinconnecting the semiconductor device package to the conductive layerthrough the at least one via through the core layer comprises at leastpartially filling the at least one via with a conductive material. 30.The method of claim 24, comprising connecting a semiconductor devicepackage to the second portion of the package substrate.
 31. The methodof claim 30, wherein connecting the semiconductor device package to thesecond portion of the package substrate comprises connecting thesemiconductor device package to the conductive layer through the atleast one via through the core layer.
 32. The method of claim 31,comprising connecting a second surface of the package substrate to amother board after connecting the semiconductor device package to thesecond portion of the package substrate, the second surface beingopposite the first surface of the first portion of the packagesubstrate, wherein the second surface extends to the second portion ofthe package substrate.
 33. The method of claim 24, comprising drillingthe at least one via through the core layer.
 34. The method of claim 24,comprising connecting a second semiconductor device to a third portionof the package substrate and encapsulating the second semiconductordevice and at least a portion of a surface of the third portion of thepackage substrate, the second portion of the package substratepositioned between the first portion and the third portion.
 35. Themethod of claim 34, comprising connecting a second surface of thepackage substrate to a mother board, the second surface being oppositethe first surface of the first portion of the package substrate, whereinthe second surface extends to the third portion of the packagesubstrate.
 36. The method of claim 35, comprising connecting asemiconductor device package to the second portion of the packagesubstrate and connecting the semiconductor device package to themotherboard.